DDR3-4GBIT-FBGA96

DDR3 memory chips

DDR3 memory chips for industrial motherboards and gateway devices requiring high RAM capacity.

FBGA-96
Industrial Motherboards / Gateways / Display Terminals
Memory chips

Description

Product Description

FBGA-96 package is a common layout for industrial motherboards, compatible with main controller chip selection. Batch documentation can be provided upon request to support production line traceability.

Specifications

Storage Capacity	4 Gbit
Package Form	FBGA-96
Interface Type	DDR3 SDRAM
Operating Temperature Range	0 ℃ ~ +85 ℃
Typical Use Cases	Industrial Motherboards, Gateways, and Display Terminals

The parameters shown represent general category ranges. Actual supply shall be based on the specification confirmed at the time of order.

Supply

Supply Details

Supply by order channel
Batch description available
Support project stock planning

Alternatives

Alternative Model

The following models are compatible alternatives with similar specifications or pinouts. Please verify details in the datasheet.

This table includes series-level reference items. Please confirm package, ratings, and fuse characteristics with engineering before bulk procurement.

Sort

Brand

Alternative Model	Brand	Encapsulate	Rated Value	Description
MT41K56M16TW-107	Micron	—	——	DDR3 4Gbit die, FBGA-96 package, industrial temperature range
K4B4G1646E	Samsung	—	——	DDR3 4 Gbit memory die, FBGA-96 package, stable supply from leading brands.
IS43TR16256B	ISSI	—	——	DDR3 4Gbit die, FBGA-96 package; industrial and automotive grades available
H5TC4G63CFR	SK Hynix	—	——	DDR3 4Gbit, FBGA-96 package, low-power 1.35V version

MT41K56M16TW-107

MicronHetero-encapsulation

Encapsulate: —
Rated Value: —/ —

DDR3 4Gbit die, FBGA-96 package, industrial temperature range

K4B4G1646E

SamsungHetero-encapsulation

Encapsulate: —
Rated Value: —/ —

DDR3 4 Gbit memory die, FBGA-96 package, stable supply from leading brands.

IS43TR16256B

ISSIHetero-encapsulation

Encapsulate: —
Rated Value: —/ —

DDR3 4Gbit die, FBGA-96 package; industrial and automotive grades available

H5TC4G63CFR

SK HynixHetero-encapsulation

Encapsulate: —
Rated Value: —/ —

DDR3 4Gbit, FBGA-96 package, low-power 1.35V version

Alternative models are for reference only. Please confirm final selection based on application requirements and datasheets. For further recommendations, feel free to submit an inquiry.